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IBASE TECHNOLOGY

ET870 Modulo CPU IntelŪ AtomŪ x7/ x5 COM Express tipo 6 (R3.0).

● IntelŪ AtomŪ x7-E3950 integrato a 2,0 GHz o x5-E3930 a 1,8 GHz [supporto i-Temp]
● 2x socket SO-DIMM DDR3L-1866, max. 16 GB
● Supporta 2 display indipendenti, DisplayPort/ DVI-D/ LVDS o eDP tramite carrier board (IP419)
● Supporta audio HD tramite Carrier Board (IP419)
● Ampia gamma di temperature di esercizio


Versioni standard :


ET870-I50 Modulo CPU COM Express (Tipo 6) con SoC IntelŪ AtomŪ x7-E3950 (2,0 GHz), memoria DDR3L dual-channel, supporto eDP
ET870-I50LV Modulo CPU COM Express (Tipo 6) con SoC IntelŪ AtomŪ x7-E3950 (2,0 GHz), memoria DDR3L dual-channel, supporto LVDS
ET870-I40 Modulo CPU COM Express (Tipo 6) con SoC IntelŪ AtomŪ x5-E3940 (1,8 GHz), memoria DDR3L dual-channel, supporto eDP
ET870-I40LV Modulo CPU COM Express (Tipo 6) con SoC IntelŪ AtomŪ x5-E3940 (1,8 GHz), memoria DDR3L dual-channel, supporto LVDS
ET870-I30 Modulo CPU COM Express (Tipo 6) con SoC IntelŪ AtomŪ x5-E3930 (1,8 GHz), memoria DDR3L dual-channel, supporto eDP
ET870-I30LV Modulo CPU COM Express (Tipo 6) con SoC IntelŪ AtomŪ x5-E3930 (1,8 GHz), memoria DDR3L dual-channel, supporto LVDS
IP419 Scheda portante Mini-ITX COM Express Type-6 (R3.0).
HSET870-A Dissipatore di calore per ET870
HSET870-1 Dissipatore di calore per ET870

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IBASE TECHNOLOGY
Indirizzo

BLDG. G, 11F, NO. 3-1, YUAN QU STREET, NANKANG

115Taipei

Taiwan

Request product informations ET870 Modulo CPU IntelŪ AtomŪ x7/ x5 COM Express tipo 6 (R3.0).

Product Groups: IPCs

Application sector: Machine Tools/Robotics, Assembly Machines, Packaging

Topics of interest: Trend

Keywords: #ryzen #lvds #edp #com-express